N-channel and p-channel finfet cell architecture with inter-block insulator

ABSTRACT

A finFET block architecture includes a first set of semiconductor fins having a first conductivity type, and a second set of semiconductor fins having a second conductivity type. An inter-block insulator is placed between outer fins of the first and second sets. A patterned gate conductor layer includes a first plurality of gate traces extending across the set of fins in the first block without crossing the inter-block insulator, and a second plurality of gate traces extending across the set of fins in the second block without crossing the inter-block insulator. Patterned conductor layers over the gate conductor layer are arranged in orthogonal layout patterns, and include an inter-block connector arranged to connect gate traces in the first and second blocks.

BACKGROUND

1. Field of the Invention

The present invention relates to integrated circuit devices, celllibraries, cell architectures and electronic design automation tools forintegrated circuit devices, including finFET devices.

2. Description of Related Art

FinFET style transistors have been described in D. Hisamoto et al.,IEDM, 1998; and N. Lindert et al., IEEE Electron Device Letters, p. 487,2001. FinFETs have gained acceptance recently as the requirements of lowpower and compact layout have become more demanding. In CMOS devices,N-type and P-type blocks of transistors are placed in proximity, withinsulators in between to prevent latch up, and other problems.

In the design of integrated circuits, standard cell libraries are oftenutilized. It is desirable to provide a finFET-based design architecturesuitable for implementation of cells for a standard cell library, andfor implementation of integrated circuits using finFET architectureswith flexible layout features.

SUMMARY

For FinFET blocks, the channels of the transistors comprise narrow fins,that can be susceptible to warping or other distortion when formed inregions of unbalanced stress, such as can occur at the edges adjacentthe inter-block insulators. Also, for smaller feature sizes, thereliability of polysilicon gate traces traversing the inter-blockinsulators can be compromised by the non-uniformity of the structures.

FinFET block structures suitable for implementation of a wide variety ofcells, and creation of a finFET standard cell libraries for use inintegrated circuit design are described which solve these and otherproblems. Technology is described for deploying design tools for use offinFET block architectures for integrated circuit design, and ascomponents of electronic design automation software and systems.Integrated circuits including cells comprising finFET blocks aredescribed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a simplified representation of an illustrative integratedcircuit design flow.

FIG. 2 is a simplified block diagram of a computer system suitable foruse with embodiments of the technology, as well as a circuit design andcircuit embodiments of the technology.

FIGS. 3A and 3B are simplified diagrams showing finFET structures knownin the prior art.

FIG. 4 is a simplified layout diagram of a plurality of finFET blockshaving flexible layout features, and suitable for use in the standardcell library.

FIG. 5 is a cross-section view of an isolation structure suitable foruse between finFET blocks in a structure like that of FIG. 4.

FIGS. 6A and 6B are schematic diagrams of a circuit, including a Dflip-flop and a clock driver, suitable for implementation as a standardcell using a finFET block architecture as described herein.

FIGS. 7-9 illustrate implementation of components of the circuit ofFIGS. 6A and 6B utilizing a finFET block architecture like that shown inFIG. 4.

FIG. 10 is a simplified layout diagram of a plurality of “tall” finFETblocks having floating power bus structures and other flexible layoutfeatures, and suitable for use in a flexible standard cell library.

FIG. 11 illustrates implementation of components of a clock driverutilizing the finFET block architecture like that shown in FIG. 10.

FIG. 12 is a simplified flow diagram of a process for designing a finFETblock based cell for a cell library.

FIG. 13 is a simplified flow diagram for an automated design processutilizing a liquid cell library including finFET block-based cells asdescribed herein.

FIG. 14 is a diagram of a finFET block set out for the purposes ofproviding a frame of reference to specify locations of power traces overthe block.

DETAILED DESCRIPTION

FIG. 1 is a simplified representation of an integrated circuit designflow. As with all flowcharts herein, it will be appreciated that many ofthe steps of FIG. 1 can be combined, performed in parallel or performedin a different sequence without affecting the functions achieved. Insome cases a rearrangement of steps will achieve the same results onlyif certain other changes are made as well, and in other cases arearrangement of steps will achieve the same results only if certainconditions are satisfied. Such rearrangement possibilities will beapparent to the reader.

At a high level, the process of FIG. 1 starts with the product idea(block 100) and is realized in an EDA (Electronic Design Automation)software design process (block 110). When the design is finalized, thefabrication process (block 150) and packaging and assembly processes(block 160) occur, ultimately resulting in finished integrated circuitchips (result 170).

The EDA software design process (block 110) is actually composed of anumber of steps 112-130, shown in linear fashion for simplicity. In anactual integrated circuit design process, the particular design mighthave to go back through steps until certain tests are passed. Similarly,in any actual design process, these steps may occur in different ordersand combinations. This description is therefore provided by way ofcontext and general explanation rather than as a specific, orrecommended, design flow for a particular integrated circuit.

A brief description of the component steps of the EDA software designprocess (block 110) will now be provided.

System design (block 112): The designers describe the functionality thatthey want to implement, they can perform what-if planning to refinefunctionality, check costs, etc. Hardware-software architectureselection can occur at this stage. Example EDA software products fromSynopsys, Inc. that can be used at this step include Model Architect,Saber, System Studio, and DesignWare® products.

Logic design and functional verification (block 114): At this stage,high level description language (HDL) code, such as the VHDL or Verilogcode, for modules in the system is written and the design is checked forfunctional accuracy. More specifically, the design is checked to ensurethat it produces the correct outputs in response to particular inputstimuli. Example EDA software products from Synopsys, Inc. that can beused at this step include VCS, VERA, DesignWare®, Magellan, Formality,ESP and LEDA products.

Synthesis and design for test (block 116): Here, the VHDL/Verilog istranslated to a netlist. The netlist can be optimized for the targettechnology. Additionally, the design and implementation of tests topermit checking of the finished chip occurs. Example EDA softwareproducts from Synopsys, Inc. that can be used at this step includeDesign Compiler®, Physical Compiler, Test Compiler, Power Complier, FPGACompiler, TetraMAX, and DesignWare® products. Optimization of design foruse of finFET blocks as described below can occur in this stage.

Netlist verification (block 118): At this step, the netlist is checkedfor compliance with timing constraints and for correspondence with theVHDL/Verilog source code. Example EDA software products from Synopsys,Inc. that can be used at this step include Formality, PrimeTime, and VCSproducts.

Design planning (block 120): Here, an overall floor plan for the chip isconstructed and analyzed for timing and top-level routing. Example EDAsoftware products from Synopsys, Inc. that can be used at this stepinclude Astro and IC Compiler products. FinFET block cell selection,layout and optimization can occur at this stage.

Physical implementation (block 122): The placement (positioning ofcircuit elements) and routing (connection of the same) occurs at thisstep. Example EDA software products from Synopsys, Inc. that can be usedat this step include AstroRail, Primetime, and Star RC/XT products.FinFET block cell layout, mapping and interconnect arrangements can beimplemented or optimized at this stage, using for example finFETstandard cells based on finFET block cell layouts described herein.

Analysis and extraction (block 124): At this step, the circuit functionis verified at a transistor level; this in turn permits what-ifrefinement. Example EDA software products from Synopsys, Inc. that canbe used at this stage include Custom Designer, AstroRail, PrimeRail,Primetime, and Star RC/XT products.

Physical verification (block 126): At this stage various checkingfunctions are performed to ensure correctness for: manufacturing,electrical issues, lithographic issues, and circuitry. Example EDAsoftware products from Synopsys, Inc. that can be used at this stageinclude the Hercules product.

Tape-out (block 127): This stage provides the “tape-out” data forproduction of masks for lithographic use to produce finished chips.Example EDA software products from Synopsys, Inc. that can be used atthis stage include the CATS(R) family of products.

Resolution enhancement (block 128): This stage involves geometricmanipulations of the layout to improve manufacturability of the design.Example EDA software products from Synopsys, Inc. that can be used atthis stage include Proteus/Progen, ProteusAF, and PSMGen products.

Mask preparation (block 130): This stage includes both mask datapreparation and the writing of the masks themselves. Example EDAsoftware products from Synopsys, Inc. that can be used at this stageinclude CATS(R) family of products.

Embodiments of the finFET block based technology described herein can beused during one or more of the above-described stages, including forexample one or more of stages 116 through 122 and 130. Also, finFETblock technology provides flexibility that enables the implementation ofengineering change orders ECOs, including modification of the cell sizesduring design verification stages.

FIG. 2A is a simplified block diagram of a computer system 210 suitablefor use with embodiments of the technology. Computer system 210typically includes at least one processor 214 which communicates with anumber of peripheral devices via bus subsystem 212. These peripheraldevices may include a storage subsystem 224, comprising a memorysubsystem 226 and a file storage subsystem 228, user interface inputdevices 222, user interface output devices 220, and a network interfacesubsystem 216. The input and output devices allow user interaction withcomputer system 210. Network interface subsystem 216 provides aninterface to outside networks, including an interface to communicationnetwork 218, and is coupled via communication network 218 tocorresponding interface devices in other computer systems. Communicationnetwork 218 may comprise many interconnected computer systems andcommunication links. These communication links may be wireline links,optical links, wireless links, or any other mechanisms for communicationof information. While in one embodiment, communication network 218 isthe Internet, communication network 218 may be any suitable computernetwork.

User interface input devices 222 may include a keyboard, pointingdevices such as a mouse, trackball, touchpad, or graphics tablet, ascanner, a touchscreen incorporated into the display, audio inputdevices such as voice recognition systems, microphones, and other typesof input devices. In general, use of the term “input device” is intendedto include all possible types of devices and ways to input informationinto computer system 210 or onto communication network 218.

User interface output devices 220 may include a display subsystem, aprinter, a fax machine, or non-visual displays such as audio outputdevices. The display subsystem may include a cathode ray tube (CRT), aflat-panel device such as a liquid crystal display (LCD), a projectiondevice, or some other mechanism for creating a visible image. Thedisplay subsystem may also provide non-visual display such as via audiooutput devices. In general, use of the term “output device” is intendedto include all possible types of devices and ways to output informationfrom computer system 210 to the user or to another machine or computersystem.

Storage subsystem 224 stores the basic programming and data constructsthat provide the functionality of some or all of the EDA tools describedherein, including the finFET flexible library and tools applied fordevelopment of cells for the library and for physical and logical designusing the library. These software modules are generally executed byprocessor 214.

Memory subsystem 226 typically includes a number of memories including amain random access memory (RAM) 230 for storage of instructions and dataduring program execution and a read only memory (ROM) 232 in which fixedinstructions are stored. File storage subsystem 228 provides persistentstorage for program and data files, and may include a hard disk drive, afloppy disk drive along with associated removable media, a CD-ROM drive,an optical drive, or removable media cartridges. The databases andmodules implementing the functionality of certain embodiments may bestored by file storage subsystem 228.

Bus subsystem 212 provides a mechanism for letting the variouscomponents and subsystems of computer system 210 communicate with eachother as intended. Although bus subsystem 212 is shown schematically asa single bus, alternative embodiments of the bus subsystem may usemultiple busses.

Computer system 210 itself can be of varying types including a personalcomputer, a portable computer, a workstation, a computer terminal, anetwork computer, a television, a mainframe, or any other dataprocessing system or user device. Due to the ever-changing nature ofcomputers and networks, the description of computer system 210 depictedin FIG. 2A is intended only as a specific example for purposes ofillustrating the preferred embodiments. Many other configurations ofcomputer system 210 are possible having more or less components than thecomputer system depicted in FIG. 2A.

FIG. 2B shows a memory 240 such as a non-transitory, computer readabledata storage medium associated with file storage subsystem 228, and/orwith network interface subsystem 216 can include a data structurespecifying a circuit design that includes cells from the finFET flexiblelibrary, or other finFET block based cells as described in detail below.The memory 240 can be a hard disk, a floppy disk, a CD-ROM, an opticalmedium, removable media cartridge, or other medium that stores computerreadable data in a volatile or non-volatile form. The memory 240 isshown storing a circuit design 280, including for example an HDLdescription of a circuit design, that includes one or more finFET blockcells created with the described technology. FIG. 2C is a blockrepresenting an integrated circuit 290 created with the describedtechnology that includes one or more finFET block cells, and/or cellsselected from a finFET flexible library.

FIGS. 3A and 3B are simplified illustrations showing finFET structuresin typical silicon on insulator and bulk substrate configurations,respectively. Both of these basic structures can be used in the FinFETblock cells described herein.

In FIG. 3A, a plurality of fins 301, 302, 303 is disposed on aninsulating substrate 300, such as is employed in silicon-on-insulatorintegrated circuits. The fins 301, 302, 303 comprise semiconductorbodies arranged in parallel on the substrate 300, so that they extendinto and out of page in FIG. 3A. A gate dielectric layer 305 overliesthe sides of the fins 301, 302, 303. A gate conductor 307, which can beimplemented using polysilicon for example, extends across the fins andover the gate dielectric layer 305.

FIG. 3B shows a plurality of fins 311, 312, 313 which protrude from abulk semiconductor body 310, sometimes referred to as body-tied fins. Inaddition, the individual fins are separated by shallow trench isolationstructures 316, 317. A gate dielectric layer 315 overlies the fins, 311,312, 313. A gate conductor 318 extends across the fins and over the gatedielectric layer 315.

For the embodiments of FIG. 3A and FIG. 3B, on either side of the gateconductor 307, 318, source and drain regions (not shown) are implementedin the fins. The FET transistors that result have source, channel anddrain regions in the fins, and a gate overlying the fins. Suchtransistors are often called multi-gate transistors, because the gateconductor overlies two sides of the fins, and as a result increases theeffective width of the channel. The fins used to implement the finFETtransistors can be quite narrow. For example, fins having widths on theorder of 20 nm or less can be utilized. As a result of the multi-gategate structure and the narrow widths of the fins, finFET transistorshave excellent performance characteristics and small layout areas.

FIG. 4 illustrates a plurality of finFET blocks in which finFETtransistors (and other semiconductor devices) can be arranged toimplement cells of a flexible finFET cell library. The legend in FIG. 4shows the shading for components of the finFET blocks including theshading for a semiconductor fin, the shading for a gate conductor, theshading for a first metal layer (metal 1) and the shading for a secondmetal layer (metal 2). The shading for a second metal layer istransparent, so that the traces in the second metal layer are shown inoutline only, in order to avoid obscuring underlying patterns in theillustration.

The layout in FIG. 4 illustrates a repeating pattern of finFET blocks,suitable for implementation of cells using complementary p-type andn-type transistors, known as CMOS transistors. The pattern includes ann-type block 400, a p-type block 401, a p-type block 402 and an n-typeblock 403. Isolation features, such as the isolation structure 426,separate the n-type blocks from the p-type blocks. The p-type block 402includes a set of fins, including fin 410, which are laid out inparallel on the substrate. The set of fins in the p-type block 402 shownin the illustration includes seven members. The number of members in theset of fins making up any given finFET block can vary according to theneeds of a particular implementation. The fins can be implemented on aninsulating layer, or protrude from an underlying semiconductor body (notshown), as discussed above

The n-type block 403 includes a set of fins, including fin 420, whichare laid out in parallel on the substrate. The set of fins in the n-typeblock 403 shown in the illustration includes seven members. Although thedrawings herein show that the n-type blocks and the p-type blocks haveequal numbers of fins, implementations of the technology can usedifferent numbers of fins in the various blocks. The number of membersin the set of fins making up any given finFET block can vary accordingto the needs of a particular implementation. As with the p-type block,the fins in the n-type block can be implemented on an insulating layer,or protrude from an underlying semiconductor body (not shown), asdiscussed above.

A patterned gate conductor layer overlies the fins, and includes gatetraces (shown with “gate” shading) in the plurality of finFET blocksshown in the diagram arranged along columns. The number of columns canbe selected as suits a particular implementation. The p-type block 402includes gate traces, including gate trace 412, which are elements ofthe patterned gate conductor layer, and are disposed over and orthogonalto the set of fins in the block 402. The n-type block 403 includes gatetraces, including gate trace 422, which are elements of the patternedgate conductor layer, and are disposed over and orthogonal to the set offins in the block 403.

The gate traces in the p-type block 402 can advantageously be alignedwith complementary gate traces in the n-type block 403, as illustratedin the figure, when used for example as a standard library cell layoutarchitecture. Thus, the gate trace 412 in the p-type block 402 isaligned in a column with the gate trace 422 in the n-type block 403, andorthogonal to the fins which are arranged in rows.

An isolation structure 426 is positioned between the p-type block 402and the n-type block 403. The isolation structure 426 can be used toprevent current leakage as a result of parasitic transistors and thelike which may otherwise result from the CMOS cell layout.

The p-type block 401 and n-type block 400, along with an isolationstructure between them, can be laid out in a mirror image patternrelative to the combination of the p-type block 402, isolation structure426 and n-type block 403, as illustrated in the figure.

At least one patterned conductor layer (metal 1, metal 2, etc.) overliesthe patterned gate conductor layer in embodiments of the technologydescribed here. In FIG. 4, a first patterned conductor layer (metal 1)includes a plurality of traces, only one of which (430) is illustratedin the Figure to avoid obscuring the basic layout, which overlie thepatterned gate conductor layer. The traces in the first patternedconductor layer can be advantageously arranged parallel to the gatetraces in the patterned gate conductor layer, and orthogonal to the finsas illustrated by the arrangement of trace 430. This facilitates the useof the first patterned conductor layer for interconnecting gate tracesand source/drain regions along columns in the adjacent blocks. The trace430 is an inter-block trace arranged to connect a gate trace in block400 to a gate trace in block 401, passing over the isolation structure.

Also in FIG. 4, a second patterned conductor layer (metal 2) includes aplurality of traces (e.g. 414, 424) overlying the patterned gateconductor layer. In embodiments including both patterned conductorlayers (metal 1 and metal 2), the second patterned conductor layeroverlies the first patterned conductor layer. The traces in the secondpatterned conductor layer can be advantageously arranged in rowsparallel to the fins, and orthogonal to the traces in the firstpatterned conductor layer. This facilitates the use of the secondpatterned conductor layer for interconnecting traces in the firstpatterned conductor layer and gate traces in different columns, andother traces in the first patterned conductor layer. The fins, traces inthe gate conductor layer, traces in the first patterned conductor layerand traces in the second patterned conductor layer can be interconnectedin any desired pattern using vertical conductors sometimes referred toas plugs in vias through interlayer insulators (not shown in FIG. 4).

The traces 414 and 424 in the second patterned conductor layer are usedas power buses, and adapted to be coupled to power supply voltages. Inthis example, the trace 414 is a VDD bus and the trace 424 is a VSS bus.In the repeating layout shown in FIG. 4, a VDD bus is positioned betweenadjacent p-type blocks and a VSS bus is positioned between adjacentn-type blocks. Although not required, power busses positioned betweenadjacent blocks (of the same conductivity type in this example) as shownin FIG. 4 can be tied to the bulk semiconductor body for biasing thebody. In other embodiments, the power busses can be positioned anywhereover or adjacent to the corresponding blocks of fins, using busses thatdo not include body ties. CMOS devices can be implemented between theVDD bus trace 414 and the VSS bus trace 424 utilizing the structures inthe p-type block 402 and the n-type block 403.

FIG. 5 is a cross-section taken along the gate traces in the regionsspanning between a p-type block and an n-type block, like blocks 402 and403 shown in FIG. 4. A p-type block is implemented in an n-well regionof the substrate, and includes a plurality of semiconductor fins. A fin501 lies on the edge of the p-type block, and can be referred to asouter fin 501 for the purposes of this description. Trench isolationstructures, including structure 503 lie between the fins in the p-typeblock. Likewise, a fin 502 lies on the edge of the n-type block, and canbe referred to as outer fin 502 for the purposes of this description.Trench isolation structures, including structure 504 lie between thefins in the n-type block. The fins and the trench isolation structurescan be implemented in a manner that is substantially uniform across therespective blocks. As a result, stress on the fins caused by thesurrounding structures does not significantly distort the fins.

The isolation structure shown in FIG. 5 includes a first trenchisolation structure 510, a first fin-like portion 511 of thesemiconductor body, a deep trench isolation structure 512, a secondfin-like portion 513 of the semiconductor body, and a second trenchisolation structure 514. Also, the gate trace 505 overlying the p-typeblock and the gate trace 506 overlying the n-type block terminate nearthe edges of the isolation region, for example over the trench isolationstructures 510 and 514 respectively.

FIG. 5 illustrates an isolation structure (e.g. 426 of FIG. 4) includingan inter-block insulator in a region between p-type finFET blocks andn-type finFET blocks. In some embodiments, other isolation structuresmay be utilized, including wide insulating trenches. The isolationfeature comprises an inter-block insulator in the substrate between theouter edges of adjacent blocks. The inter-block insulator can compriseone or more insulator filled trenches, and arranged in parallel with theouter fins of the first and second blocks.

In the embodiment shown in FIG. 5, the inter-block insulator comprises afirst insulator filled trench (e.g. trench isolation structure 510)adjacent the outer fin 501 of the first block, a second insulator filledtrench (e.g. trench isolation structure 514) adjacent the outer fin 502of the second block, and a third insulation filled trench (e.g. trenchisolation structure 512) between the first and second insulator filledtrenches. Although we refer to first and second insulator filledtrenches, they can be made in one processing step after the deeper,third insulator filled trench. Therefore, the use of the terms first andsecond is for illustration purposes only and does not mean necessarilythat they are implemented using separate masks or separate processingsteps.

The semiconductor fins in the first and second blocks are separated byinsulator filled trenches (e.g. structures 503, 504) having a firstdepth D1 in the substrate, and inter-block insulator comprises aninsulator filled trench (e.g. trench isolation structure 512) having adepth D2 in the substrate greater than the first depth D1.

The inter-block insulator shown in FIG. 5 includes means for balancingstress on the outer fins 501, 502 of the first and second blocks withstress due to structures (503, 504) between the outer fins and the innerfins of the corresponding sets of semiconductor fins.

The means for balancing stress in this example includes a combination ofthe first fin-like portion 511 and the first trench isolation structure510, which is characterized by having a structure that is sufficientlylike that of the outer fin 501 and the trench isolation structure 503 inthe p-type block, that distortion of the outer fin 501 in the p-typeblock, that would otherwise result from asymmetrical stress fromstructures on opposing sides of the outer fin 501, is substantiallyreduced. Likewise, the combination of the second fin-like portion 513,and the second trench isolation structure 514 is characterized by havinga structure that is sufficiently like that of the outer fin 502 and thetrench isolation structure 504 in the n-type block, that distortion ofthe outer fin 502 in the n-type block, that would otherwise result fromasymmetrical structures is substantially reduced. The width of thefin-like portions 511, 513 may be significantly greater than the widthof the fins in some embodiments. Also, the fin-like portions 511, 513may have top surfaces that are aligned with the top surfaces of the fin501 and the fin 502 in some embodiments. Other embodiments include morethan one fin-like portion/trench combination between the centralinsulator filled trench and the outer fins of the blocks.

Also, the deep trench isolation structure 512 in this example extendssubstantially deeper into the semiconductor body than the trenchisolation features between the fins, in order to provide greaterisolation performance. Structural stress induced by the deep trenchisolation structure 512 is buffered from fins in the p-type block by thecombination of the first fin-like portion 511, and the first trenchisolation feature 510, and from the fins in the n-type block by thecomplementary structures 513, 514. The deep trench isolation structurecan be wider than shown in the figure. In the Figure, the width of theisolation structure, including elements 510 to 514 can be on the orderof 5 feature widths. Alternatively, the structure can have larger widthsby increasing the width of the deep trench isolation structure 512, andof the other elements. Because the connection of the gate traces 505 and506 on the opposing sides of the isolation structure, is made usingpatterned metal layer and because the gate traces are not tied orcontacted over the isolation structure, the width does not impactreliability or performance of the gate traces.

An insulating fill 515 provides an interlayer insulator between thepatterned gate conductor layer including the gate traces 505 and 506,and overlying patterned conductor layers, including the first patternedconductor layer M1 in this example. The insulating fill 515 can beimplemented using material having a relatively low dielectric constant,relative to that of silicon dioxide (low-K materials), if desired for aparticular implementation. The insulating fill 515 can be planarized,without impacting the isolation structure (including the deep trenchisolation structure 512) and without impacting the patterned gateconductor layer. Connections between gate traces in adjacent blocks canbe implemented using the first patterned conductor layer M1 by formingtrace 520 that extends in a line parallel with the gate traces 505, 506.Inter-layer connectors, such as plugs 521 and 522 extend through vias inthe insulating fill 515 to connect gate traces 505 and 506,respectively, to the trace 520. Orthogonal traces (e.g. trace 530) inthe second patterned conductor layer M2 can be utilized to interconnecttraces, such as trace 520, in the first patterned conductor layer M1, asdiscussed above in connection with FIG. 4. Connections between the trace530 in the second patterned conductor layer M2 and trace 520 in thefirst patterned conductor layer Ml can be implemented using aninter-layer connector, such as a plug 531 extending through a via in aninterlayer insulator (not shown).

FIGS. 6A and 6B are schematic diagrams of a representative cellcomprising a D flip-flop and clock buffer, respectively, which can beimplemented using the finFET block architecture described herein, andincluded in a cell library for use in integrated circuit design. Thebasic D flip-flop includes a first stage having a D input, a CKB inputand a CK input. The basic D flip-flop includes an output Q and aninverted output QB.

The first stage includes p-type transistors 601 and 602 in seriesbetween the power bus VDD and node 650, and n-type transistors 603 and604 in series between the ground bus VSS and the node 650. The CKB andCK inputs are connected to p-type transistor 602 and n-type transistor603, respectively, and the D input is coupled to both p-type transistor601 and n-type transistor 604. The node 650 between the p-type andn-type transistors is coupled to the input of a latch that comprisesinverters 605 and 606 arranged in a feedback relationship. A secondstage of the D flip-flop is similar, having input coupled to the outputof the latch in the first stage, CKB input and a CK input. The secondstage includes p-type transistors 611 and 612 in series between thepower bus

VDD and an output node, and n-type transistors 613 and 614 in seriesbetween the ground bus VSS and the output node. The CKB and CK inputsare connected to n-type transistor 613 and p-type transistor 612, andthe output of the first stage is coupled to both p-type transistor 601and n-type transistor 604. The node between the p-type and n-typetransistors is coupled to the input of a latch that comprises inverters615 and 616 arranged in a feedback relationship. The output Q of the Dflip-flop is provided at the output of the latch comprising inverters615 and 616. An output inverter 620 drives the inverted output QB of theD flip-flop.

In FIG. 6B, the basic structure of a clock driver is shown. The input tothe clock driver is a clock signal CKin. The clock driver includes afirst inverter 630 and a second inverter 631 in series. The output ofthe first inverter 630 is the inverted clock CKB, and the output of thesecond inverter 631 is the clock CK, both of which are used in the Dflip-flop as illustrated in FIG. 6A. In one example cell, a setincluding for example four (4) D flip-flops can be combined with ashared clock driver. In such cases, the clock driver can be designed todrive all four flip-flops. In this example, the inverters in the clockdriver can comprise two or more p-type transistors in parallel betweenVDD and the output node, and two or more n-type transistors in parallelbetween VSS and the output node.

The circuit of FIGS. 6A and 6B can be implemented using the finFET blockarchitecture described herein. An example implementation is describedwith reference to layout diagrams in FIGS. 7-9, which show the fourtransistor, D flip-flop input stage, a latch and a clock buffer.

In FIG. 7, the finFET block layout includes a p-type finFET block 701, an-type finFET block 702 and an isolation structure in region 703. Theinputs of the circuit shown in FIG. 6A, including the D input, the trueclock CK input, the inverted clock CKB input, the VDD bus and a VSS busare connected to traces 710-714, respectively, in the second conductorlayer (metal 2). Likewise the output of the stage (corresponding to node650 in FIG. 6A) is connected to a trace 715 in the second conductorlayer. Three types of plugs interconnecting the layers are representedin the figure. Plugs, such as plug 732, in block 701 represented by asquare with a single cross line from the lower left corner to the upperright corner connect the traces in the first patterned conductor layerto source/drain terminals on the fins. Plugs, such as plug 724,connected to gate trace 720 in block 701 represented by a square with asingle cross line from the upper left corner to the lower right corner,connect the traces in the first patterned conductor layer to gate tracesin the patterned gate conductor layer. Plugs, such as plug 723,connected to the input trace 710, represented by a square with an “X”pattern of crossed lines, connect the traces in the second patternedconductor layer to traces in the first patterned conductor layer and/orto lower layers.

The D input signal on trace 710 is connected to trace 722 in the firstpatterned conductor layer via the plug 723. The trace 722 is connectedto gate traces 720 and 721 in the p-type and n-type blocks via plugs724, 725. The gate traces 720 and 721 correspond to the gates oftransistors 601 and 604 in FIG. 6A. The source terminals on the fins(e.g. fins 730, 731) adjacent the gate trace 720 are connected to metal1 trace 733 via plugs including plug 732. The metal 1 trace 733 isconnected to the VDD bus 713 via plug 734. Likewise, the sourceterminals on the fins (e.g. fin 740) adjacent the gate trace 721 areconnected to metal 1 trace 743 via plugs (e.g. plug 742). Metal 1 trace743 is connected via plug 744 to the VSS bus 714. The source/drainterminals to the right of gate traces 720 and 721 are shared with theadjacent transistors, and not coupled to overlying conductors in thisexample. The inverted clock CKB signal on metal 2 trace 711 is connectedto metal 1 trace 752 via plug 753. Trace 752 is connected to gate trace755 in the p-type block, via plug 754. The gate trace 755 corresponds tothe gate of transistor 602 in FIG. 6A. The clock CK input on metal 2trace 712 is connected via plug 763 to metal 1 trace 762. The metal 1trace 762 is connected via plug 764 to the gate trace 765 in the n-typeblock. The gate trace 765 corresponds to the gate of transistor 603 inFIG. 6A. The drain terminals in the fins to the right of gate trace 755are connected via plugs (e.g. plug 771) to metal 1 trace 770. The metal1 trace 770 spans across the isolation region 703, and is connected viaplugs (e.g. plug 775) to the fins in the n-type block. Also the metal 1trace 770 is connected via plug 772, to the metal 2 trace 715, providingthe output of the input stage (corresponding to node 650 in FIG. 6A) ofthe D flip-flop. The gate traces in both the p-type block and the n-typeblock which are to the right of the metal 1 trace 770 in this layoutinclude isolation structures (e.g. 780) that can comprise insulatorfilled trenches that cut though the gate traces and the underlying fins,and serve to divide the input stage from other circuit elements (notshown) further to the right.

FIG. 8 is a layout diagram of a finFET block structure, like that ofFIG. 7, connected as a latch circuit which can be used as a component ofa D flip-flop as shown in FIG. 6A. In FIG. 8, the finFET block structureis labeled with columns and rows as a means of simplifying thedescription. The labeled columns include source/drain columns S/D1 toS/D3, which comprise columns of source/drain terminals on the finsbetween gate traces, and gate columns G1 to G3, which comprise thelocations of gate traces that overlie the fins. The labeled rows includefin rows F1 to F14, which comprise the semiconductor body fins in theblock. The metal 1 traces, metal 2 traces, gate traces and fins areidentified by their location in the columns and rows in the followingdescription.

The latch circuit in FIG. 8 includes first and second inverters, each ofwhich includes a p-type transistor and an n-type transistor in series,and having their gates connected in common, and so includes fourtransistors.

The layout includes a metal 2 trace over the isolation structureconnected to provide the input of the latch, such as would be connectedto the trace 715 of FIG. 7. The metal 2 trace over the isolationstructure is connected to a metal 1 trace on column G1, corresponding tothe input of the first inverter, and a metal 1 trace on column S/D3,corresponding to the output of the second inverter. The metal 1 trace oncolumn G1 extends over both the p-type and n-type blocks, connecting thegate traces for the fins making up the p-type transistor to the gatetraces on the fins making up the n-type transistor of the firstinverter. The metal 1 trace on column S/D3 extends over both the p-typeand n-type blocks, connecting the source/drain terminals in the fins inthe p-type block and the source/drain terminals in the fins in then-type block, which provide the output of the second inverter.

The layout includes a metal 2 trace over row F4 which provides theoutput signal of the latch. The metal 2 trace on row F4 is connected toa metal 1 trace on column S/D1, corresponding to the output of the firstinverter, and a metal 1 trace on column G2, corresponding to the inputof the second inverter. The metal 1 trace on column S/D 1 extends overboth the p-type and n-type blocks, connecting the source/drain terminalson the fins making up the p-type transistor to the source/drainterminals on the fins making up the n-type transistor of the firstinverter. The metal 1 trace on column G2 extends over both the p-typeand n-type blocks, connecting the gate traces in column G2 in the p-typeblock and the gate traces in column G2 in the n-type block, whichoverlie the channels on the fins making up the p-type transistor and onthe fins making up the n-type transistor of the second inverter. Themetal 1 trace on column G2 corresponds to the input of the secondinverter.

The metal 1 trace in column S/D2 over the p-type block connects thesource/drain terminals in column S/D2 to the metal 2 trace acting as aVDD bus. Likewise, the metal 1 trace in column S/D2 over the n-typeblock connects the source/drain terminals in column S/D2 to the metal 2trace acting as a VSS bus.

As illustrated in FIG. 8, isolation structures (like the isolationstructures 780 described in FIG. 7) in the gate traces separate unusedfins from those fins used in the circuit being implemented.

FIG. 9 illustrates a layout of an eight transistor clock driver,comprising two inverters in series, where each inverter includes twop-type and two n-type transistors in parallel. The clock driver havingthis layout should be strong enough to drive clock signals for a numberof D flip-flops, such as 4 D flip-flops, in a standard cell. Input isprovided on a metal 2 trace over the isolation structure and is coupledto metal 1 traces in columns G1 and G2. The metal 1 trace in the columnG1 is connected to the gate traces over the fins making up the p-typeand n-type transistors in the column G1. The metal 1 trace in the columnG2 is connected to the gate traces over the fins making up the p-typeand n-type transistors in the column G2.

A first metal 1 trace in the column S/D 1 is connected to thesource/drain terminals in the p-type block and to the metal 2 tracemaking up the VDD bus. A second metal 1 trace in the column S/D1 isconnected to the source/drain terminals in the n-type block and to themetal 2 trace making up the VSS bus. In a similar fashion, a first metal1 trace in the column S/D3 is connected to the source/drain terminals inthe p-type block, and to the metal 2 trace making up the VDD bus. Asecond metal 1 trace in the column S/D3 is connected to the source/drainterminals in the n-type block, and to the metal 2 trace making up theVSS bus.

A metal 1 trace in the column S/D2 extends across both the p-type blockand the n-type block, and is connected to the source/drain terminals inthe p-type block and in the n-type block, which are driven by both thetransistors on the left and the transistors on the right in parallel.The metal 1 trace in the column S/D2 is connected to the metal 2 tracein row F7 which provides the inverted clock CKB output.

The metal 2 trace in row F4 is also connected to the metal 1 traces incolumns G3 and G4, which act as the inputs for the parallel transistorpairs of the second inverter. The metal 1 trace in the column G3 isconnected to the gate traces over the fins making up the p-type andn-type transistors in the column G3. The metal 1 trace in the column G4is connected to the gate traces over the fins making up the p-type andn-type transistors in the column G4.

The first metal 1 trace in the column S/D3 is connected to thesource/drain terminals in the p-type block to the left of column G3 andto the metal 2 trace making up the VDD bus. The second metal 1 trace inthe column S/D3 is connected to the source/drain terminals in the n-typeblock and to the metal 2 trace making up the VSS bus. In a similarfashion, a first metal 1 trace in the column S/D5 is connected to thesource/drain terminals in the p-type block and to the metal 2 tracemaking up the VDD bus. A second metal 1 trace in the column S/D5 isconnected to the source/drain terminals in the n-type block, and to themetal 2 trace making up the VSS bus.

A metal 1 trace in the column S/D4 extends across both the p-type blockand the n-type block, and is connected to the source/drain terminals inthe p-type block and in the n-type block, which are driven by both thetransistors on the left and the transistors on the right in parallel.The metal 1 trace in the column S/D4 is connected to the metal 2 tracein row F5 which provides the buffered clock CK output.

The layout shown in FIG. 9 implements parallel transistors that use four( ) fins each for a total of eight fins. Because the finFET block isonly seven fins high, the implementation of an eight fin transistorrequired implementation using a least two additional gate columns, andonly partial utilization of the fins.

In the embodiment shown in FIG. 9, the eight transistor clock bufferlayout leaves a number of fins unused (for example, fins F1-F3 and finsF12-F14). These unused fins can be utilized to adjust a circuit designduring a design flow for a particular integrated circuit, to change thestrength or speed of the buffers. Also, the unused fins can be utilizedto implement an engineering change order ECO on a given circuit layoutthat may occur after a complete layout and testing has occurred.

FIG. 10 illustrates a floating power bus layout, including a pluralityof “tall” finFET blocks in which finFET transistors (and other devices)can be arranged to implement cells of a finFET liquid cell library. Thedrawing in FIG. 10 can be understood using the legend in FIG. 4.

The layout in FIG. 10 illustrates a repeating pattern of finFET blocks,suitable for implementation of cells using complementary p-type andn-type transistors, known as CMOS cells. The pattern includesalternating tall p-type and tall n-type blocks, including a p-type block1000, an n-type block 1001, a p-type block 1002 and an n-type block1003. Isolation features 1030, 1031, 1032, which can comprise structureslike that of FIG. 5, separate the n-type blocks from the p-type blocks.The p-type block 1002 includes a set of fins, including fin 1010, whichare laid out in parallel on the substrate. The set of fins in the p-typeblock 1002 shown in the illustration includes fourteen members, tochoose an example that includes twice as many fins as the exampledescribed with reference to FIG. 4. The set of fins in a particularblock (e.g. 1000-1003) include outer fins (e.g. fins 1060, 1061 inregion 1001) on outside edges of the sets of fins, and inner finsbetween the outer fins arranged in a pattern identifiable as separatefrom the pattern of fins in adjacent blocks, and preferably with uniformspacing between the fins within the block. The number of members in theset of fins making up any given finFET block can vary according to theneeds of a particular implementation. It may be advantageous for aparticular implementation to use a number of fins that is a power of 2,such as 16 fins, 32 fins and so on. The fins can be implemented on aninsulating layer, or protrude from an underlying semiconductor body (notshown), as discussed above

The n-type block 1001 includes a set of fins, including fin 1020, whichare laid out in parallel on the substrate. The set of fins in the n-typeblock 1001 shown in the illustration includes the same number of fins asthe corresponding p-type blocks 1000 and 1002. The fins in the n-typeblock can be more narrow than those in the p-type block, as illustrated,because of the differences in carrier mobility for the devices. Thenumber of members in the set of fins making up any given finFET blockcan vary according to the needs of a particular implementation, but canadvantageously match the number of fins in its complementary p-typeblock, when used for example as a standard library cell layoutarchitecture. As with the p-type block, the fins in the n-type block canbe implemented on an insulating layer, or protrude from an underlyingsemiconductor body (not shown), as discussed above.

A patterned gate conductor layer overlies the fins, and it includes gatetraces (shown with “gate” shading) in the plurality of finFET blocksshown in the diagram arranged along columns. The number of columns canbe selected as suits a particular implementation. The p-type block 1002includes gate traces, including gate trace 1012, which are elements ofthe patterned gate conductor layer, and are disposed over and orthogonalto the set of fins in the block 1002. The n-type block 1001 includesgate traces, including gate trace 1022, which are elements of thepatterned gate conductor layer, and are disposed over and orthogonal tothe set of fins in the block 1001.

The gate traces in the p-type block 1002 can advantageously be alignedin columns with complementary gate traces in the n-type block 1001, asillustrated in the figure, when used for example as a standard librarycell layout architecture. Thus, the gate trace 1012 in the p-type block1002 is aligned in a column with the gate trace 1022 in the n-type block1001, and orthogonal to the fins which are arranged in rows.

An isolation structure 1042 is positioned between the p-type block 1002and the n-type block 1001. The isolation structure 1042 can be used toprevent current leakage as a result of parasitic transistors and thelike which may otherwise result from the CMOS cell layout.

The p-type block 1000 and n-type block 1003, along with isolationstructures 1041 and 1043, can be laid out in a repeating patternrelative to the combination of the p-type block 1002, isolationstructure 1030 and n-type block 1001, as illustrated in the figure.

At least one patterned conductor layer (metal 1, metal 2, etc.) overliesthe patterned gate conductor layer in embodiments of the technologydescribed here. In FIG. 10, a first patterned conductor layer (metal 1)includes a plurality of traces, only one of which (1040) is illustratedin the figure to avoid obscuring the basic layout, which overlie thepatterned gate conductor layer. The traces in the first patternedconductor layer can be advantageously arranged parallel to the gatetraces in the patterned gate conductor layer, and orthogonal to the finsas illustrated by the arrangement of trace 1040. This facilitates theuse of the first patterned conductor layer for interconnecting gatetraces and source/drain regions along columns in the adjacent blocks.

Also in FIG. 10, a second patterned conductor layer (metal 2) includes aplurality of traces (1030 to 1037) overlying the patterned gateconductor layer. In embodiments including both patterned conductorlayers (metal 1 and metal 2), the second patterned conductor layeroverlies the first patterned conductor layer. The traces in the secondpatterned conductor layer can be advantageously arranged in rowsparallel to the fins, and orthogonal to the traces in the firstpatterned conductor layer. This facilitates the use of the secondpatterned conductor layer for interconnecting traces in the firstpatterned conductor layer and gate traces in different columns, andother traces in the first patterned conductor layer. The fins, traces inthe gate conductor layer, traces in the first patterned conductor layerand traces in the second pattern conductor layer can be interconnectedin any desired pattern using vertical conductors sometimes referred toas plugs in vias through interlayer insulators (not shown in FIG. 10).

The traces 1030 to 1037 in the second patterned conductor layer that areillustrated in FIG. 10 overly inner fins in the set of fins in thecorresponding regions are used as power buses, and adapted to be coupledto power supply voltages. As compared to the structures illustrated inFIGS. 4 and 7-9 where the power bus traces are placed outside the outerfins in the corresponding regions to accommodate for example use of bodyties between the power buses and the substrate, the structure of FIG. 10provides flexibility in the utilization of the FinFET blocks. In thisexample, the traces 1034 and 1035 are VDD bus traces over the inner finsin the p-type block 1002. The traces 1032 and 1033 are VSS bus tracesover the inner fins in the n-type block 1001. In a flexible layout, aplurality of VDD bus traces are positioned over each p-type block overrows selected to optimize power distribution in the circuits beingimplemented. Likewise, a plurality of VSS bus traces are positioned overeach n-type block without constraints on placement that would beintroduced by a requirement for body ties, over rows selected tooptimize power distribution in the circuits being implemented. So,embodiments could be implemented where a single “tall” finFET block,including a plurality of power buses overlying it, is arranged withcomplementary finFET blocks that include only one power bus. The powertraces are preferably essentially straight and parallel with the fins,over the regions including sets of fins. In other embodiments, the powertraces can have more complex shapes, including T- shapes, L-shapes andso on, over the regions that include the sets of fins. In a given blockarchitecture, one, two, three or more power buses may be placed over asingle set of fins.

CMOS devices can be implemented in a region 1050 using connectionsbetween the VDD bus 1034 in p-type block 1002 and the VSS bus 1033 inthe n-type block 1001, utilizing the fins in the p-type block 1002 andthe n-type block 1001 (upper devices). Also, CMOS devices can beimplemented in a region 1051 using connections between the VDD bus 1035in p-type block 1002 and the VSS bus 1036 in the n-type block 1003,utilizing the fins in the p-type block 1002 and the n-type block 1003(lower devices). Suitable isolation structures (e.g. 1052) can be formedin the fins and gate traces between the regions 1050 and 1051, such asby a providing a patterned trench filled with insulating material.Likewise, the n-type block 1001 can be used with the p-type block 1000for CMOS devices in region 1053, with appropriate isolation 1054. Withisolation 1055, block 1000 can be used in combination with another block(not shown) and so on, in an efficient and flexible layout. Bypositioning the power buses and isolation structures appropriately, thenumbers of fins within a single block used for the upper devices and thenumber of fins within the same single block used for the lower devicescan vary according to the needs of the circuits, and more efficientutilization of the finFET blocks can be realized for cellimplementations.

FIG. 11 illustrates some of the flexibility possible using “tall” finFETblocks with multiple power buses over each block, including one or morepower bus over inner fins in a given block. FIG. 11 uses the row andcolumn notation introduced above in connection with FIGS. 8-9, havingouter fins F1 and F14. The element implemented in FIG. 11 is the p-typecomponent of a strong clock driver which could be used in a standardcell having four D flip-flops, similar to the clock driver shown in FIG.9. The implementation shown in FIG. 9, however, utilizes four gatecolumns and five source/drain columns, while the implementation shown inFIG. 11 utilizes only two gate columns G1 and G2 and three source/draincolumns S/D1 to S/D3. Also, the implementation shown in FIG. 11 makesmore complete usage of the available fins.

In this example, a metal 2 trace over row F11 is coupled to the inputclock CKin, and connected to the metal 1 trace over gate column G1,which is in turn coupled to the gate trace in column G1 over rows F1through F 14, that extends over the isolation structure to thecomplementary n-type block. The source/drain terminals of column S/D1 infins F1 to F6 and fins F9 to F14 are connected to a metal 1 trace overcolumn S/D1, which is in turn coupled to a metal 2 trace between rows F8and F9 which provides the inverted clock output CKB. The source/drainterminals in fins F1 to F6 in column S/D2 are connected to a metal 1trace over column S/D2, which is in turn coupled to a metal 2 trace overrow F3 acting as a first VDD power bus for the block. Also, source/drainterminals in fins F9 to F14 in column S/D2 are connected to a metal 1trace over column S/D2, which is in turn coupled to a metal 2 trace overrow F13 acting as a second VDD power bus for the block.

The metal 2 trace between rows F8 and F9 that carries the inverted clockoutput CKB is connected to the gate trace in column G2 extending overthe fins in rows F1 to F14. A metal 1 trace in column G2 corresponds tothe input to the second inverter in the driver, and is coupled to thegate trace in column G2, and extends across the isolation structure tothe complementary finFET block. The source/drain terminals of columnS/D3 in fins F1 to F6 and fins F9 to F14 are connected to a metal 1trace over column S/D3, which is in turn coupled to a metal 2 tracebetween rows F5 and F6 which provides the buffered clock output CK. Thefins in rows F7 and F8 are not utilized in this example. As a result,patterned insulating trenches, such as the trenches 1101, 1102, areimplemented to cut the unused fins, and thereby isolate them from thecircuits in a component. The pattern insulating trenches like trenches1101, 1102 can be positioned in the layout as necessary to assist individing and isolating circuit elements.

FIG. 12 is a simplified flow diagram of a process for designing a finFETblock based cell for a cell library. The order of the steps can bemodified as suits a particular designer. According to the simplifiedflow diagram, a functional cell to be included in a cell library isselected (1200). Such a cell can be a multibit flip-flop as describedabove, logic gates, logic blocks or other cell structures. Next, finFETblocks are specified, assuming CMOS technology, for n-type and p-typedevices (1201). The finFET blocks include respective sets ofsemiconductor fins arranged in rows. The blocks are separated byisolation structures as discussed above. Then the patterned gateconductor layer is specified, to form gates in columns overlying thefins that will be used in the cell (1202). Then, the patterned conductorlayers overlying the gate conductor layer are specified, to establishappropriate interconnections, preferably including a first layer havingtraces arranged in columns, and a second layer having traces arranged inrow (1203). The plurality of patterned conductor layers include powertraces, and can include more than one power trace over at least one ofthe finFET blocks. Then the interlayer connections are specified, tolocate connections among the fins, the gate traces and the traces in theone or more patterned conductor layers (1204). The specificationsproduced in this method comprise layout files implemented in a GDS IIformat data base file representing the specified planar shapes of theelements, or other computer readable format. The specified cells arethen stored in a cell library for use in integrated circuit design(1205).

FIG. 13 is a flowchart for a representative design automation processwhich can be implemented as logic executed by a system like thatrepresented by FIG. 2, including a finFET block library having cellsimplementing using at least one “tall” finFET block with floating powerbuses as described herein. According to a first step of the process, adata structure that defines a circuit description is traversed in dataprocessing system (1300). A cell library stored in a database or othercomputer readable medium coupled with the data processing system, thatincludes finFET block-based cells is described herein, is accessed bythe data processing system, and utilized to matched cells in the librarywith the elements of the circuit description (1301). The matched cellsare then placed and routed for an integrated circuit layout (1302).Next, design verification and testing is executed (1303). Finally,finFET block cells can be modified to optimize timing or powerspecifications for the circuit (1304). The modifications of the finFETblock cells can comprise mask changes that result in changes to thetraces in the first and second patterned conductor layers, and in thepattern of interlayer connectors, to change the number of fins utilizedin a particular transistor. These changes can be accomplished withoutchanging the area on the integrated circuit occupied by the cell.

FIG. 14 is a drawing of a block 1400 that includes a set of fins and thegate traces, with power traces 1410 and 1420 overlying the fins. FIG. 14uses the row and column notation introduced above in connection withFIGS. 8-9, having outer fins F1 and FN, and inner fins F2 to F(N-1). Forthe purposes of this description, the block 1400 can be said to have anarea that corresponds with the outline of the set of fins, defined bythe lengths of the fins in the horizontal dimension, and by the distancebetween the outside edges of the outer fins F1 and FN. The ability toplace power traces in positions that overlie the fins of a block arisesin part because embodiments of the flexible block architecture describedutilize power traces that are not connected to the semiconductor body(or bodies) within the area of the block. In other words, the powertraces over the block do not include body ties within the area of theblock.

The illustrated power traces 1410 and 1420 have rectangular shapes overthe block. The power traces 1410 and 1420 are part of a power bus, andconnected to continuing portions of the trace that are not over theblock (i.e. outside the left and right sides of the block) and are notillustrated. The continuing traces can adopt any pattern necessary orsuitable for the placement of the circuit, but are not considered partsof the power traces overlying the block for the purposes of thisdescription, in order to provide a basis for defining a location of thepower trace over the block. One can define the position of a power traceover or overlying a block by the position of a center of area over theblock. Thus, the power trace 1410 over the block 1400 has a center ofarea at a position represented by the box 1411. The power trace 1420over the block has a center of area at a position represented by the box1421. As mentioned above, the power traces over the block may have morecomplex shapes than the simple rectangles represented in FIG. 14.However, one can characterize any two-dimensional shape by center ofarea, and define the location of the power trace overlying the block bythe location of its center of area. In the illustration, it can be seenthat the center of area 1411 of the power trace 1410 is located insidethe outside edge of the outer fin F1. Thus, the power trace 1410 can becharacterized as over the block. Also, one can characterize the positionof the power trace with reference to its edges. Thus, the power trace1420 has outer edge that is inside the outer edge along the side of theouter fin FN, and is likewise over the block. Embodiments of theflexible block architecture described herein can include power traceshaving more complex shapes which have outer edges inside the outer edgesof the outer fins of the block, so that they do not extend across thesides of the block defined by the outer edges of the outer fins. Also,embodiments of the flexible block architecture described herein can havepower traces such as the trace 1410, which has a center of area that isinside the outer edge of the outer fins of the block, while it outeredge may be outside the outer fin. It is advantageous to utilize powertraces over the blocks that are essentially straight and elongatedparallel with the fins in the block as shown in the figures herein, forthe purposes of ease and uniformity of layout and design. The presenttechnology enables the use of such power traces.

A finFET block architecture described above can be utilized to create aflexible library that comprises a plurality of finFET block-based cells.The finFET blocks in the library can have fine granularity with partialcolumn usage across the cells.

The problem of bent or warped fins can be avoided using isolationstructures as described herein.

Integrated circuits as described herein do not require bulk body ties tothe power buses that overlie the finFET blocks at regular cellboundaries, or between n-type and p-type blocks, allowing fullflexibility of power trace location overlying the fins of the finFETblocks, rather than in additional layout space adjacent the fins. Inaddition, a plurality of power buses can be implemented over a givenfinFET block.

The finFET blocks described herein can be arranged in a repeatingpattern of n-type blocks and p-type blocks, allowing for flexibleimplementation of CMOS circuit elements utilizing complementary portionsin blocks above and below a particular block, where at least a centralblock includes a plurality of power traces overlying the block.

The finFET block architecture described herein allows for very densearea utilization with flexible layout strategies. The technology can beespecially suited for multiple bit flip-flops and sequential elementswidely used in integrated circuit logic. In addition, the technology canbe suited for implementation of gate arrays, field programmable gatearrays, “sea of gates” architectures and other high density and/or highperformance integrated circuit structures.

The flexible layout in orthogonal pattern structures make the finFETblocks described herein ideal for implementing engineering change ordersfor size changes, or other modifications, during design verificationprocesses during integrated circuit design and manufacturing.

The finFET block architecture described herein can be implemented withmixed block heights, so that standard finFET blocks can be mixed with“tall” finFET blocks, or variable sized blocks can be utilized, as suitsthe needs of a particular design goal. The finFET block architecturedescribed herein enables utilization of a central block, such as ap-type finFET block, to implement a first set of complementary n-typeand p-type devices using an upper n-type finFET block, and to implementa second set of complementary n-type and p-type devices using a lowern-type finFET.

In general, the creation of a finFET block-based flexible library isenabled using the finFET block architecture described herein. In suchlibrary, the standard cells can consist of “soft macros” that could bepopulated with some flexibility as to the exact location of theirunderlying elements. Unlike planar CMOS structures, where thegranularity for modifications or adjustments of the cells is the wholetransistor, in finFET block architectures as described herein, thegranularity can be the fin. Designing finFET block structures using asubset of the fins arranged in parallel in a block provides for designflexibility.

Flexibility provided by the present design enables using power andground buses anywhere over the region, and allows for optimizing theheight of the finFET blocks by experimentation or other optimizationtechniques during cell design for the library, to improve layout andperformance flexibility. A library can be comprised of a plurality offinFET block-based cells which exploit subsets of the available fins inthe finFET blocks, leaving room for optimization procedures that do notalter the area of the layout. The library can be designed applying aminimum granularity to a single fin in the block for a gate trace alonga column traversing a block of horizontal fins, rather than all of thefins in the block.

While the present invention is disclosed by reference to the preferredembodiments and examples detailed above, it is to be understood thatthese examples are intended in an illustrative rather than in a limitingsense. It is contemplated that modifications and combinations willreadily occur to those skilled in the art, which modifications andcombinations will be within the spirit of the invention and the scope ofthe following claims. What is claimed is:

1. An integrated circuit, comprising: a substrate; a first blockincluding a set of semiconductor fins in a first region of thesubstrate, the first block including outer fins on opposing outsideedges of the first block, and inner fins between the outer fins, thefirst block being arranged for devices having channels with a firstconductivity type; a second block including a set of semiconductor finsin a second region of the substrate, the second block including outerfins on opposing outside edges of the second block, and inner finsbetween the outer fins, the second block being arranged for deviceshaving channels with a second conductivity type; an inter-blockinsulator in a third region of the substrate between outer fins of thefirst and second blocks; a patterned gate conductor layer including afirst plurality of gate traces in the first block extending across theset of fins in the first block without crossing the inter-blockinsulator, and a second plurality of gate traces in the second blockextending across the set of fins in the second block without crossingthe inter-block insulator; at least one patterned conductor layer overthe gate conductor layer, including an inter-block trace crossing overthe inter-block insulator, and arranged to connect a gate trace in thefirst plurality of gate traces to a gate trace in the second pluralityof gate traces; and a plurality of inter-layer connectors that connectsemiconductor fins, gate traces, the inter-block trace and traces in theat least one patterned conductor layer.
 2. The integrated circuit ofclaim 1, wherein the inter-block insulator comprises one or moreinsulator filled trenches, and is arranged in parallel with the outerfins of the first and second blocks.
 3. The integrated circuit of claim1, wherein the inter-block insulator comprises a first insulator filledtrench adjacent the outer fin of the first block, a second insulatorfilled trench adjacent the outer fin of the second block, and a thirdinsulation filled trench between the first and second insulator filledtrenches.
 4. The integrated circuit of claim 1, wherein thesemiconductor fins in the first and second blocks are separated byinsulator filled trenches having a first depth in the substrate, and theinter-block insulator comprises an insulator filled trench having adepth in the substrate greater than the first depth.
 5. The integratedcircuit of claim 1, wherein the semiconductor fins in the first andsecond blocks are separated by insulator filled trenches having a firstdepth in the substrate, and the inter-block insulator comprises a firstinsulator filled trench adjacent the outer fin of the first block, asecond insulator filled trench adjacent the outer fin of the secondblock, and a third insulation filled trench between the first and secondinsulator filled trenches, the third insulator filled trench having adepth in the substrate greater than the first depth.
 6. The integratedcircuit of claim 1, wherein the inter-block insulator comprises meansfor balancing stress on the outer fins of the first and second blockswith stress due to structures between the outer fins and the inner finsof the corresponding sets of semiconductor fins.
 7. The integratedcircuit of claim 1, wherein the semiconductor fins include channelsbeneath gate traces in the plurality of gate traces, and source/drainterminals between gate traces in the plurality of gate traces, andwherein the at least one patterned conductor layer and the plurality ofinter-layer connectors are arranged to connect one or more of thesource/drain terminals in the first block to one or more of thesource/drain terminals in the second block.
 8. The integrated circuit ofclaim 1, including one or more power traces overlying each of the firstand second blocks.
 9. The integrated circuit of claim 8, wherein theplurality of gate traces in the first and second blocks are arranged incolumns, and traces in the at least one patterned conductor layer arearranged to connect one of the power traces overlying the second blockto a semiconductor fin in the second block acting as a terminal of afirst device having a gate in a first gate trace in a particular column,and to connect another of the one or more power traces overlying thesecond block to another semiconductor fin in the second block acting asa terminal of a second device, the second device having a gate in asecond gate trace in said particular column.
 10. The integrated circuitof claim 8, wherein the at least one patterned conductor layer includesa first patterned conductor layer over the pattern gate conductor layer,and a second patterned conductor layer over the first patternedconductor layer, and wherein the one or more power traces overlying eachof the first and second blocks comprise portions of the second patternedconductor layer.
 11. The integrated circuit of claim 8, wherein thesemiconductor fins in the first and second blocks are arranged inparallel, the gate traces in the plurality of gate traces are orthogonalto the semiconductor fins, the inter-block trace is parallel to the gatetraces, and the one or more power traces overlying the first and secondblocks are parallel with the semiconductor fins.
 12. The integratedcircuit of claim 8, wherein the sets of semiconductor fins include asemiconductor body or bodies in the first and second blocks, and whereinthe one or more power traces overlying the first and second blocks arenot connected to the semiconductor body or bodies within thecorresponding blocks.
 13. A method for manufacturing a cell library,comprising: specifying a base structure comprising: a first blockincluding a set of semiconductor fins in a first region of thesubstrate, the first block including outer fins on opposing outsideedges of the first block, and inner fins between the outer fins, thefirst block being arranged for devices having channels with a firstconductivity type; a second block including a set of semiconductor finsin a second region of the substrate, the second block including outerfins on opposing outside edges of the second block, and inner finsbetween the outer fins, the second block being arranged for deviceshaving channels with a second conductivity type; an inter-blockinsulator in a third region of the substrate between outer fins of thefirst and second blocks; specifying a cell on the base structure, thecell comprising elements of: a patterned gate conductor layer includinga first plurality of gate traces in the first block extending across theset of fins in the first block without crossing the inter-blockinsulator, and a second plurality of gate traces in the second blockextending across the set of fins in the second block without crossingthe inter-block insulator; at least one patterned conductor layer overthe gate conductor layer, including a inter-block trace crossing overthe inter-block insulator, and arranged to connect a gate trace in thefirst plurality of gate traces to a gate trace in the second pluralityof gate traces; a plurality of inter-layer connectors that connectsemiconductor fins, gate traces, the inter-block trace and traces in theat least one patterned conductor layer; and storing machine readablespecifications of the cell in a cell library.
 14. The method of claim13, wherein the inter-block insulator comprises one or more insulatorfilled trenches, and is arranged in parallel with the outer fins of thefirst and second blocks.
 15. The method of claim 13, wherein theinter-block insulator comprises a first insulator filled trench adjacentthe outer fin of the first block, a second insulator filled trenchadjacent the outer fin of the second block, and a third insulationfilled trench between the first and second insulator filled trenches.16. The method of claim 13, wherein the semiconductor fins in the firstand second blocks are separated by insulator filled trenches having afirst depth in the substrate, and the inter-block insulator comprises aninsulator filled trench having a depth in the substrate greater than thefirst depth.
 17. The method of claim 13, wherein the semiconductor finsin the first and second blocks are separated by insulator filledtrenches having a first depth in the substrate, and the inter-blockinsulator comprises a first insulator filled trench adjacent the outerfin of the first block, a second insulator filled trench adjacent theouter fin of the second block, and a third insulation filled trenchbetween the first and second insulator filled trenches, the thirdinsulator filled trench having a depth in the substrate greater than thefirst depth.
 18. The method of claim 13, wherein the inter-blockinsulator comprises means for balancing stress on the outer fins of thefirst and second blocks with stress due to structures between the outerfins and the inner fins of the corresponding sets of semiconductor fins.19. The method of claim 13, wherein the semiconductor fins includechannels beneath gate traces in the plurality of gate traces, andsource/drain terminals between gate traces in the plurality of gatetraces, and wherein the at least one patterned conductor layer and theplurality of inter-layer connectors are arranged to connect one or moreof the source/drain terminals in the first block to one or more of thesource/drain terminals in the second block.
 20. The method of claim 13,wherein the base structure comprises one or more power traces overlyingeach of the first and second blocks.
 21. The method of claim 20, whereinthe plurality of gate traces in the first and second blocks are arrangedin columns, and traces in the at least one patterned conductor layer arearranged to connect one of the power traces overlying the second blockto a semiconductor fin in the second block acting as a terminal of afirst device having a gate in a first gate trace in a particular column,and to connect another of the one or more power traces overlying thesecond block to another semiconductor fin in the second block acting asa terminal of a second device, the second device having a gate in asecond gate trace in said particular column.
 22. The method of claim 20,wherein the at least one patterned conductor layer includes a firstpatterned conductor layer over the patterned gate conductor layer, and asecond patterned conductor layer over the first patterned conductorlayer, and wherein the one or more power traces overlying each of thefirst and second blocks comprise portions of the second patternedconductor layer.
 23. The method of claim 20, wherein the semiconductorfins in the first and second blocks are arranged in parallel, the gatetraces in the plurality of gate traces are orthogonal to thesemiconductor fins, the inter-block trace is parallel to the gatetraces, and the one or more power traces overlying the first and secondblocks are parallel with the semiconductor fins.
 24. The method of claim20, wherein the sets of semiconductor fins include a semiconductor bodyor bodies in the first and second blocks, and wherein the one or morepower traces overlying the first and second blocks are not connected tothe semiconductor body or bodies within the corresponding blocks.
 25. Adata processing system adapted to process a computer implementedrepresentation of a circuit design, comprising: a data processor andmemory coupled to the data processor, the memory storing instructionsexecutable by the data processor, including instructions to match cellsspecified in a machine readable circuit description with cells in a celllibrary, the cell library including a plurality of cells having a basestructure comprising: a first block including a set of semiconductorfins in a first region of the substrate, the first block including outerfins on opposing outside edges of the first block, and inner finsbetween the outer fins, the first block being arranged for deviceshaving channels with a first conductivity type; a second block includinga set of semiconductor fins in a second region of the substrate, thesecond block including outer fins on opposing outside edges of thesecond block, and inner fins between the outer fins, the second blockbeing arranged for devices having channels with a second conductivitytype; an inter-block insulator in a third region of the substratebetween outer fins of the first and second blocks; a cell in theplurality of cells including: a patterned gate conductor layer includinga first plurality of gate traces in the first block extending across theset of fins in the first block without crossing the inter-blockinsulator, and a second plurality of gate traces in the second blockextending across the set of fins in the second block without crossingthe inter-block insulator; at least one patterned conductor layer overthe gate conductor layer, including an inter-block trace crossing overthe inter-block insulator, and arranged to connect a gate trace in thefirst plurality of gate traces to a gate trace in the second pluralityof gate traces; and a plurality of inter-layer connectors that connectsemiconductor fins, gate traces, the inter-block trace and traces in theat least one patterned conductor layer.
 26. The system of claim 25,wherein the inter-block insulator comprises one or more insulator filledtrenches, and is arranged in parallel with the outer fins of the firstand second blocks.
 27. The system of claim 25, wherein the inter-blockinsulator comprises a first insulator filled trench adjacent the outerfin of the first block, a second insulator filled trench adjacent theouter fin of the second block, and a third insulation filled trenchbetween the first and second insulator filled trenches.
 28. The systemof claim 25, wherein the semiconductor fins in the first and secondblocks are separated by insulator filled trenches having a first depthin the substrate, and the inter-block insulator comprises an insulatorfilled trench having a depth in the substrate greater than the firstdepth.
 29. The system of claim 25, wherein the semiconductor fins in thefirst and second blocks are separated by insulator filled trencheshaving a first depth in the substrate, and the inter-block insulatorcomprises a first insulator filled trench adjacent the outer fin of thefirst block, a second insulator filled trench adjacent the outer fin ofthe second block, and a third insulation filled trench between the firstand second insulator filled trenches, the third insulator filled trenchhaving a depth in the substrate greater than the first depth.
 30. Thesystem of claim 25, wherein the inter-block insulator comprises meansfor balancing stress on the outer fins of the first and second blockswith stress due to structures between the outer fins and the inner finsof the corresponding sets of semiconductor fins.
 31. The system of claim25, wherein the semiconductor fins include channels beneath gate tracesin the plurality of gate traces, and source/drain terminals between gatetraces in the plurality of gate traces, and wherein the at least onepatterned conductor layer and the plurality of inter-layer connectorsare arranged to connect one or more of the source/drain terminals in thefirst block to one or more of the source/drain terminals in the secondblock.
 32. The system of claim 25, wherein the base structure comprisesone or more power traces overlying each of the first and second blocks.33. The system of claim 32, wherein the plurality of gate traces in thefirst and second blocks are arranged in columns, and traces in the atleast one patterned conductor layer are arranged to connect one of thepower traces overlying the second block to a semiconductor fin in thesecond block acting as a terminal of a first device having a gate in afirst gate trace in a particular column, and to connect another of theone or more power traces overlying the second block to anothersemiconductor fin in the second block acting as a terminal of a seconddevice, the second device having a gate in a second gate trace in saidparticular column.
 34. The system of claim 32, wherein the at least onepatterned conductor layer includes a first patterned conductor layerover the patterned gate conductor layer, and a second patternedconductor layer over the first patterned conductor layer, and whereinthe one or more power traces overlying each of the first and secondblocks comprise portions of the second patterned conductor layer. 35.The system of claim 32, wherein the semiconductor fins in the first andsecond blocks are arranged in parallel, the gate traces in the pluralityof gate traces are orthogonal to the semiconductor fins, the inter-blocktrace is parallel to the gate traces, and the one or more power tracesoverlying the first and second blocks are parallel with thesemiconductor fins.
 36. The system of claim 32, wherein the sets ofsemiconductor fins include a semiconductor body or bodies in the firstand second blocks, and wherein the one or more power traces overlyingthe first and second blocks are not connected to the semiconductor bodyor bodies within the corresponding blocks.
 37. An article ofmanufacture, comprising: a memory readable by a data processor, thememory storing the cell library including a plurality of cells, at leastone cell having a base structure comprising: a first block including aset of semiconductor fins in a first region of the substrate, the firstblock including outer fins on opposing outside edges of the first block,and inner fins between the outer fins, the first block being arrangedfor devices having channels with a first conductivity type; a secondblock including a set of semiconductor fins in a second region of thesubstrate, the second block including outer fins on opposing outsideedges of the second block, and inner fins between the outer fins, thesecond block being arranged for devices having channels with a secondconductivity type; an inter-block insulator in a third region of thesubstrate between outer fins of the first and second blocks; the atleast one cell including: a patterned gate conductor layer including afirst plurality of gate traces in the first block extending across theset of fins in the first block without crossing the inter-blockinsulator, and a second plurality of gate traces in the second blockextending across the set of fins in the second block without crossingthe inter-block insulator; at least one patterned conductor layer overthe gate conductor layer, including a inter-block trace crossing overthe inter-block insulator, and arranged to connect a gate trace in thefirst plurality of gate traces to a gate trace in the second pluralityof gate traces; and a plurality of inter-layer connectors that connectsemiconductor fins, gate traces, the inter-block trace and traces in theat least one patterned conductor layer.